Infrared Reflow Oven T-962C

Features

1.A large infrared soldering area

Drawer size: 400*600mm; this increases the usage range of this machine drastically and makes it an economical investment.

2.Choice of different soldering cycles

Parameters of eight soldering cycles are predefined and the entire soldering process can be completed automatically from Preheat, Soak and Reflow through to cool down.

3. Special heat up and temperature equalization with all designs

Uses up to2900 Watts of energy efficient Infrared heating and air circulation to re-flow solder.

4.Ergonomic design, practical and easily operated

Good build quality but at the same time light weight and a small footprint allows the T962C to be easily bench positioned transported or stored.

5.Large number of available functions

The T962C can solder most single-side or double-side PCB boards small parts, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.

Technical Parameter