Infrared BGA Rework Station T-835

• Use infrared heat lamp. Heat is easy to pierce and distribute evenly, which overcomes disadvantages (burn out elements) of traditional welder  machines..

• Infrared heating doesn't have air flow. Don't impact circumjacent small elements. It is suitable for all of the  flat elements. It can be used to unsolder BGA, SMD, CSP, LGA, QFP and PLCC, especially Micro BGA and SMD elements.

• T835 works with preheating oven T-8120/T-8280, which can repair all kinds of needle-socket (such as CPU socket and inserted row GAP).

• Easy operation. Just need one-day training, you can operate it skillfully. 

Technical parameter 

Main Parts