Mini PCB preheating Oven T-8120
Features：
1. The machine selects the infrared highly effective component to give off heat which independent exploration, adopt advanced PID intelligent controlling warm heating technology, controls warm precisely.2. Can achieve to heat PCB board and component which contains lead or not,especially suit
to BGA,SMD.
3. Use infrared heat, easy to cut through, heat proportion, don’t have sirocco flow. Don’t shift the small component on the PCB board,ensure the welding quality.
4. T-8120 has 600W heating system, widely to 120x120mm.
Can use with the handhold infrared welder T-835.
5. Easily operate, can operate it through easy training.
5. Easily operate, can operate it through easy training.
Main Parameters：
|
Work bench size |
200x240mm |
|
Rated voltage and frequency |
AC220-230V/AC110V 60/50Hz |
|
Complete machine power |
500W |
|
Preheating chassis power |
450W |
|
Preheating chassis size |
120x120mm |
|
Temperature adjustable range |
0-450℃ |
Main Parts：
|
Preheating oven main body |
1 |
|
Temperature sensor |
1 |
|
Board support of the circuit |
1 |
|
Power line |
1 |
|
User manual (USB flash disc) |
1 |