Mini PCB Preheating Oven T-8120

Features：

1. The machine selects the infrared highly effective component to give off heat which independent exploration, adopts advanced PID intelligent controling heating technology, controls warm precisely.
2. Can achieve to heat PCB board and component which contains lead or not,especially suits to BGA,SMD.
3. Use infrared heat, easy to cut through, heat evenly, don’t have hot air flow. Don’t shift the nontarget small components on the PCB board,ensure the welding quality.
4. T-8120 has 600W heating system, widely to 120x120mm preheating size.

Can work with the handhold infrared welder T-835.
5. Easily operate, can operate it through easy training.

Main Parameters：

Work bench size	200x240mm
Rated voltage and frequency	AC220-230V/AC110V 60/50Hz
Complete machine power	500W
Preheating chassis power	450W
Preheating chassis size	120x120mm
Temperature adjustable range	0-450℃